Printed Circuit Board Assembly (PCBA)

With a world class infrastructure, state-of-the-art machines and skilled manpower, operated on the principles of Lean Manufacturing Practices of JIT, 5S, Kaizen, Six Sigma and one-piece flow, AREL offers to its customers a best in class PCBA manufacturing service.

As much as we are strict and diligent in sourcing and supply chain, the care in the factory starts at the IGS with a climatically controlled environment. It is ESD safe, complete with test and verification of equipment, where every part coming in is professionally verified and certified before entering our electronic stores which is regularly monitored for temperature, humidity and ESD compliance. We practice the unique FEFO Control (First Expiry First Out) for the issue of components to manufacturing. The store is complete with an MSD dry cabinet with RH of Max 2 % for MSL components. A separate store is provided for chemicals and other consumables.

Dedicated kitting areas are equipped with offline loading, splicing and split reels management to optimize the setup time and ensure that the MUV is in control. The area is also equipped with storage systems for Paste/Glue, Baking Facility & Vacuum Seal facility for MSL components. Specialized equipments for forming, lead cutting and kinking for customization is available. Serial number and traceability is managed through 1D & 2D barcode stickers, as well as Laser Marking, provided on the PCB.

Equipped with an installed capacity of 500,000 CPH and separate lines for ROHS and Non-ROHS, the below-mentioned details give an overview of the capability of the machines in the plant.

  • High Speed Stencil Printers with Universal stencil cleaner
  • Software to track tool life and Verification of Set up accuracy
  • Semi-automated Stencil Positioning with alignment motorized via actuators X, Y and Theta
  • PCB handing max size - 510 MM X 508 MM
  • PCB thickness handling capability - 0.6 mm to 6 mm M/C alignment accuracy - > 2Cpk +/- 12.5Micron @ 6 Sigma #
  • Printing accuracy - > 2Cpk +/- 25 Micron @ 6 Sigma# Fully programmable Automated under stencil cleaning with wet/dry/vacuum wipe with external solvent tank
  • HawkEye® 750 digital camera for Quick inspection for deposited solder paste quality
  • Stencil tension maintained at 40 Nm for accurate printing
  • Koh Young Online SPI with 3 D facility.
  • Volume repeatability < 3% at 3 Sigma.
  • Height accuracy -1 Micron.
  • Speed - 22 to 56.1 Cm2/Sec.
  • In-built SPC data analysis with Real-time SPC, Multiple Display and SPC Alarm.
  • Metrology Capability: Volume, Area, Height, Offset, Bridging, Shape deformity, Coplanarity.
  • Closed-loop network with Solder Paste Printer for online corrections for Print Quality.
  • Panasonic, Siemens & Fuji machines.
  • Lines equipped for:
  • High Mix / Low & Medium Volume
  • Low Mix / High Volume
  • Max PCB size capability - 708 mm X 500 mm.
  • Capability to handle small components of 01005.
  • Capability to handle large components of size 75mmX 125mm.
  • Proficient in handling and placement of POP (Package on Package).
  • Pin paste process capability.
  • PCB Types handled - Rigid, Flex, Rigid Flex and Metal Core like AL PCBs.
  • Online and Offline set up verification systems to check the accuracy of loaded parts.
  • Nitrogen ready machines with chiller facility alongwith center support.
  • Online profiling and offline profiling for NPI and Set up changes/Shift changes.
  • 9+2 and 10+2 Zones with TOP and BOTTOM Heating.
  • Temp Ranges - 25 Degree C to 350-degree C.
  • Accuracy - +/- 1 Degree C.
  • Inline 3D and 2D visual inspection.
  • Intuitive 3D profile review to verify any component lift and solder joint shape.
  • Imaging speed of 21.7cm²/sec with an optical resolution of 15 microns.
  • Real-time SPC and production yield management.
  • GE makes 3D X-ray with a CT scan to examine PTH fillets on multilayer boards and BGA solderability like voids, cracks and head on pillow, etc.
  • Can be used on any board with a thickness of 3 mm with 0.5-micron accuracy.
  • High Penetration of 160KV and 6000X magnification.
  • Anti-collision feature to protect samples.
  • Intuitive automatic BGA solder-joint evaluation and automatic voiding calculation.
  • VJ Electronix Summit 1800 SRT offers BGA/POP rework with Specialized machine and
  • selective nozzles as per customer requirements with an accuracy of 12 micron.
  • High Power 2.4 kW Top Heater, 5.6 kW Bottom Heater.
  • Solder Scavenging with Programmable Motorized X-Y Table, 22” x 30” Board handling.
  • Router Elite EM5700N -PCBA of 550 X500 mm & Accuracy of +/- 0.01mm.
  • Separators of HEDA 801-N L- PCB up to 600mm & speed of 300mm /sec.
  • Online ESD safe vacuum PCB Cleaner / Buffer /Flipper/Unloader etc.
  • JT, TMPL & EMS wave soldering machines.
  • Nitrogen ready machines with chiller facility.
  • Spray Nozzle for Flux Coating.
  • 3 Preheating zones with bottom heating.
  • Temperature Range - 25 degC-350 degC.
  • Solder Pot Motorized IN & OUT.
  • Standard full Titanium Solder-Pot and 1/2 HP high power mechanical pumps.
  • Wave Surfer for Offline Thermal profiling for NPI and Set up changes/Shift changes.
  • Operators are trained in IPC 610 F for acceptance criteria and IPC 7711 and 7721 for the rework of SMT and PTH components.
  • AREL Operators were qualified for international soldering competition.
  • The capability of conformal coating with Automated machine /Brush and DIP to protect the PCBA from environmental contamination like dust/moisture etc.
  • Conveyorized oven curing, Baking or Air curing.
  • UV light inspection facility.
  • Special equipment measures the thickness of the coating.
  • Expertise in potting & developing jigs for application and curing.